Welcome to the website of Shenzhen Right Automation Equipment Co., Ltd.!TEL:+86 755-36698520 Site Map
Home > News > Industry News
我是分类列表

DEK VectorGuard high-tensile stencil: the best solder paste printing effect

Time : 2020-04-21

Click : 151

DEK VectorGuard high-tensile stencil: the best solder paste printing effect

Core Tip: Use simple and easy-to-use foil installation technology to install the steel mesh foil in a separate steel mesh frame, so that different steel mesh foils can be replaced and installed on the frame. This technology saves 75% of the steel mesh storage space because it is no longer necessary to install a separate steel mesh frame for each steel mesh.

     DEK VectorGuard Innovative solder paste printing process through the use of economical, high-yield printing processes


1.png


  DEK VectorGuard Using simple and easy-to-use foil installation technology, the steel mesh foil is installed in a separate steel mesh frame, so that different steel mesh foils can be replaced and installed on the frame. This technology saves 75% of the steel mesh storage space because it is no longer necessary to install a separate steel mesh frame for each steel mesh. The steel mesh of the traditional wire mesh tension assembly decreases with time, and continuous use and cleaning cause aging, so the elasticity of the steel mesh becomes weak. This will cause the steel mesh to "sag", affecting the alignment of the mesh and the pad, and thus the amount of printing. DEK VectorGuard fixes the steel mesh in a suitable position to obtain uniform tension, ensuring long-term printing effectiveness and achieving the best printing results。
Main advantages:
1.Reduce storage space
2.Improve the safety of operator manual operation
3.Improve the accuracy of the steel mesh position
4.Better process control thanks to the flatness of the steel grid
5.Achieve optimal performance with the SIPLACE Pro Optimizer suite
       SIPLACE Pro Optimizer The kit is integrated into every SIPLACE Pro software, such as the SPLACE Recipe Analyzer and SPLACE Precedence Finder. With just a few mouse clicks, the placement step analysis tool can determine the best placement procedure, and the placement interference analysis tool can prevent interference during placement, and even prevent production scenarios where multiple components are mixed-mounted.

2.png


  The placement step analysis tool helps to achieve faster and more efficient production by analyzing "steps". This "step" consists of production line data with device-specific parameters, configuration data and optimization data. For further improvement, it allows users to analyze circuit board data and placement processes offline. For example, if the rotation axis acceleration is set to a parameter required by a particular component shape, the placement step analysis tool will remind you that you should make the necessary adjustments for other component reels and trays. SMD interference analysis tools ensure that the placement can be controlled in an interference-free manner for a complex task, such as mounting high-density circuit boards with different component heights and sizes. It can identify interference between components and nozzles around the mounting position.
       Thanks to the application of these two tools, we can always ensure that our customers' first-class ASM equipment meets the highest requirements in terms of efficiency and quality.
Important advantages:
1.Check the virtual placement data to ensure a higher pass rate
2.Prevent mounting interference of high-density circuit boards
3.Allows manual change of placement order for more flexible programming